Abstract: In order to reduce the maximum temperature of the electronic components on printed circuit board (PCB) and optimize the scheme of thermal design. We constructed a mathematical model of the steady-state temperature field of electronic components on PCB by using the micro-element body heat balance method according to the principle of heat transfer, and verified the effectiveness of the model  by using the thermal simulation software ICEPAK for electronic products. We made  discretization improvement based on the surface-simplex swarm evolution algorithm, and used the improved discrete surface-simplex swarm evolution (DSSSE) algorithm to adjust the layout of distributed electronic components on PCB. Simulation results show that the proposed algorithm can reduce the maximum temperature of the electronic components on the PCB and has a fast convergence speed.

Key words: thermal design, electronic component, discrete surface-simplex swarm evolution algorithm, thermal layout optimization