吉林大学学报(工学版)

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新型环氧树脂固化剂的性能

张春玲1,孙国恩1,张莉1,那辉2   

  1. 1.吉林大学 材料科学与工程学院, 长春 130022; 2.吉林大学 化学学院, 长春 130012
  • 收稿日期:2006-04-11 修回日期:2006-07-18 出版日期:2007-03-01 发布日期:2007-03-01
  • 通讯作者: 张春玲

Curing properties of the novel curing agent of epoxy resin

Zhang Chun-ling1,Sun Guo-en1,Zhang Li1,Na Hui2   

  1. 1.College of Materials Science and Engineering,Jilin University,Changchun 130022,China; 2.College of Chemistry,Jilin University,Changchun 130012,China
  • Received:2006-04-11 Revised:2006-07-18 Online:2007-03-01 Published:2007-03-01
  • Contact: Zhang Chun-ling

摘要: 采用亲核取代反应合成了新型含有醚酮键的芳香胺固化剂(BADK),并对其结构进行了表征。选用BADK作为固化剂,对含有联苯结构的环氧树脂和通用型环氧树脂E51的固化条件、固化物耐热性和吸湿性进行了研究。实验结果表明:新型固化剂的使用提高了通用型环氧树脂E51的热性能;含联苯结构的环氧树脂固化物与E51相比,无论是热性能还是耐湿性都有很大的提高。

关键词: 有机高分子材料, 环氧树脂, 固化剂, 吸湿性

Abstract: re absorption ) of an epoxy resin with biphenyl rings and the common epoxy resin (E51) were investigated by addition of a new aromatic amine curing agent with groups ether and ketone. The experimental results show that, by the introduction of the novel curing agent, the heat resistance of the common epoxy resin (E51) is enhanced much better than it used to and the heat resistance and moisture absorption of the epoxy resin with biphenyl rings are significantly improved compared with those of common epoxy resin (E51).

Key words: organic polymer material, epoxy resin, curing agent, moisture absorption

中图分类号: 

  • TB324
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