吉林大学学报(工学版) ›› 2004, Vol. ›› Issue (4): 538-543.

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Composition design of Sn-Zn-Bi system lead-free solder

WU Wenyun, QIU Xiaoming, SUN Daqian, LIU Weihong, LI Minggao   

  1. College of Materials Science and Engineering, Jilin University, Changchun 130022, China
  • Received:2004-03-14 Online:2004-10-01

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Abstract: By means of the quadratic regression combination design process, the regression equations relating the wettability, the mechanical property and the corrosion resistance of the solder to its element compositions were established. The influences of the elements on the wettability, the joint shearing strength and the corrosion resistance were analyzed. The results prove that adding more Zn improves the joint shearing strength, but at the same time the wettability and the corrosion resistance decline; adding appropriate amount of Bi can improve the wettability, joint shearing strength and the corrosion resistance distinctly. The interaction of Zn and Bi also affects the performance of the solder. After considering all the effects of solder ingredients to the melting point, the pasty range and so on, the contribution of Sn-Zn-Bi Pb-free solder used in electronic industry has been optimized. The result is 8%～9% for Zn and 3%～4% for Bi.

Key words: metallic material, Pb-free solder, Sn-Zn-Bi system, composition, optimization

CLC Number: 

  • TG425.1
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