Sn-Zn-Bi无铅钎料成分设计

吉林大学学报(工学版) ›› 2004, Vol. ›› Issue (4): 538-543.

Sn-Zn-Bi无铅钎料成分设计

吴文云, 邱小明, 孙大谦, 刘卫红, 李明高

吉林大学材料科学与工程学院, 吉林长春 130022

收稿日期:2004-03-14 出版日期:2004-10-01
通讯作者: 孙大谦(1954- ),男,教授,博士生导师.E-mail:sundaqian@vip.sina.com
基金资助:
吉林大学创新基金资助项目(2002 CX)

Composition design of Sn-Zn-Bi system lead-free solder

WU Wenyun, QIU Xiaoming, SUN Daqian, LIU Weihong, LI Minggao

College of Materials Science and Engineering, Jilin University, Changchun 130022, China

Received:2004-03-14 Online:2004-10-01

摘要/Abstract

摘要： 利用二次回归正交组合设计建立了SnZnBi无铅钎料成分与润湿性能、力学性能及抗腐蚀性能的回归方程,分析了成分质量分数对钎料润湿性能、接头剪切强度及钎缝抗腐蚀能力的影响规律。结果表明:增加Zn的质量分数有助于提高接头剪切强度,但同时也使钎料润湿性和钎缝抗腐蚀性能下降;添加适量质量分数的Bi能明显改善钎料的润湿性、接头剪切强度和钎缝抗腐蚀性;Zn、Bi交互作用对钎料和接头性能有一定的影响。在综合考虑成分变化对钎料熔点、熔化温度区间等影响后,优化设计出用于电子工业的ω(Zn)=8%～9%、ω(Bi)=3%～4%的SnZnBi无铅钎料。

关键词: 金属材料, 无铅钎料, Sn-Zn-Bi系, 成分, 优化

Abstract: By means of the quadratic regression combination design process, the regression equations relating the wettability, the mechanical property and the corrosion resistance of the solder to its element compositions were established. The influences of the elements on the wettability, the joint shearing strength and the corrosion resistance were analyzed. The results prove that adding more Zn improves the joint shearing strength, but at the same time the wettability and the corrosion resistance decline; adding appropriate amount of Bi can improve the wettability, joint shearing strength and the corrosion resistance distinctly. The interaction of Zn and Bi also affects the performance of the solder. After considering all the effects of solder ingredients to the melting point, the pasty range and so on, the contribution of Sn-Zn-Bi Pb-free solder used in electronic industry has been optimized. The result is 8%～9% for Zn and 3%～4% for Bi.

Key words: metallic material, Pb-free solder, Sn-Zn-Bi system, composition, optimization

中图分类号:

TG425.1

吴文云, 邱小明, 孙大谦, 刘卫红, 李明高. Sn-Zn-Bi无铅钎料成分设计[J]. 吉林大学学报(工学版), 2004, (4): 538-543.

WU Wenyun, QIU Xiaoming, SUN Daqian, LIU Weihong, LI Minggao. Composition design of Sn-Zn-Bi system lead-free solder[J]. 吉林大学学报(工学版), 2004, (4): 538-543.

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