关键词: 材料表面与界面, 化学镀, 纳米铜膜, 电阻率, 玻璃基体

Abstract: Nanocrystalline Cu films were prepared on an unetched glass substrate by an electroless plating technique with using Sodium Dodecyl Benzene Sulfonate (SDBS) as an additive in the bath. The morphologies of surface and crosssection and crystalline structure were characterized by FESEM, SEM and XRD. Experimental results show that the nodules in the Cu films are pretty fine, the grain size ranges from 15.5 nm to 28.3 nm, and an enhanced 〈111〉 texture existes in the Cu films. The resistivity of the Cu films was examined by fourpoint probe method. The reason that the resistivity of the Cu films decreases with the increase of the deposition time was discussed.

Key words: surface and interface of materials, electroless plating, nanocrystalline Cu film, resistivity, glass substrate