吉林大学学报(工学版) ›› 2018, Vol. 48 ›› Issue (3): 796-802.doi: 10.13229/j.cnki.jdxbgxb20171132

• Orginal Article • Previous Articles     Next Articles

Micro contact mechanism based on force in self rotation grinding of silicon wafer

REN Qing-lei, WEI Xin, XIE Xiao-zhu, HU Wei   

  1. School of Electro-mechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China
  • Received:2017-11-22 Online:2018-05-20 Published:2018-05-20

Abstract: Self rotating grinding with cup type diamond wheel is a typical ultra precision grinding process for silicon wafer. In this paper, a mechanical model of the micro contact between the wheel micro unit and silicon wafer was established for the stable ductile grinding process, and the mechanism of self rotating grinding was studied using force decomposition method. On the normal direction, the load and stress distribution of the corresponding elastic and plastic stages were obtained using the Hertz theory and the cavity model respectively. On the tangential direction, the sliding friction force was obtained using micro tribology theory. The load in the two directions was synthesized and the total stress condition was obtained. The analysis results were verified by corresponding experiment and simulation.

Key words: mechanical manufacture and automation, self rotating grinding, micro contact, silicon wafer, wheel micro unit

CLC Number: 

  • TG580.1
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