吉林大学学报(工学版) ›› 2018, Vol. 48 ›› Issue (3): 796-802.doi: 10.13229/j.cnki.jdxbgxb20171132
• Orginal Article • Previous Articles Next Articles
REN Qing-lei, WEI Xin, XIE Xiao-zhu, HU Wei
CLC Number:
[1] Markku T, Teruaki M, Veli-Matti A, et al.Handbook of Silicon based MEMS Materials and Technologies[M]. 2nd ed. London:William Andrew,2015. [2] Pei Z J, Strasbaugh A.Fine grinding of silicon wafers[J]. International Journal of Machine Tools and Manufacture,2001,41(5):659-672. [3] Matsui S.An experimental study on the grinding of silicon wafer-the wafer rotation grinding method[J]. Bull Japan Soc Prec Eng,1988,22(4):295-300. [4] Zhou L,Tian Y B,Huang H,et al.A study on the diamond grinding of ultra-thin silicon wafers[J]. Journal of Engineering Manufacture,2012,226(1):66-75. [5] Pei Z J,Fisher G R, Milind B, et al.A grinding-based manufacturing method for silicon wafers: an experimental investigation[J]. International Journal of Machine Tools & Manufacture,2005,45(10):1140-1151. [6] 康仁科,田业冰,郭东明,等. 大直径硅片超精密磨削技术的研究与应用现状[J]. 金刚石与磨料磨具工程,2003,136(4):13-18. Kang Ren-ke,Tian Ye-bing,Guo Dong-ming, et al.Present status of research and application in ultra-precision grinding technology of large-scale silicon wafers[J]. Diamond & Abrasives Engineering,2003,136(4):13-18. [7] Yan J W,Tooru A,Hirofumi H,et al.Fundamental inverstigation of subsurface damage in single crystalline silicon caused by diamond machining[J]. Precision Engineering,2009,33:378-386. [8] 霍凤伟. 硅片延性域磨削机理研究[D]. 大连:大连理工大学机械工程学院,2006. Huo Feng-wei.Study on the mechanism of ductile mode grinding of silicon wafers[D]. Dalian: School of Mechanical Engineering, Dalian University of Technology,2006. [9] Johnson K L.Contact Mechanics[M]. London:Cambridge University Press,1985. [10] 张赜文. 单压头曲率半径对单晶硅和氮化碳薄膜径向纳动损伤的影响[D]. 成都:西南交通大学机械工程学院,2010. Zhang Ze-wen.Effect of equivalent radius of indenter on the radial nanofretting damage of monocrystal silicon and α-CN [11] 任庆磊,魏昕,谢小柱,等. 硅片自旋转磨削中基于作用力的微观接触仿真研究[J]. 金刚石与磨料磨具工程,2016,36(2):19-23. Ren Qing-lei,Wei Xin,Xie Xiao-zhu, et al.Simulation of micro contact based on interacting force in self rotating grinding of silicon wafer[J]. Diamond & Abrasives Engineering,2016,36(2):19-23. |
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