吉林大学学报(工学版) ›› 2016, Vol. 46 ›› Issue (3): 824-830.doi: 10.13229/j.cnki.jdxbgxb201603022
• Orginal Article • Previous Articles Next Articles
WANG Ben, WANG Xiao-li
CLC Number:
| [1] Beyaz M I, Hanrahan B M, Feldman J, et al. Monitoring of actuation conditions in a micro-turbo-generator[J]. IEEE Sensors Journal,2013,13(8):2937-2943. [2] Xie G X, Ding J N, Liu S H, et al. Interfacial properties for real rough MEMS/NEMS surfaces by incorporating the electrostatic and Casimir effects-a theoretical study[J]. Surface and Interface Analysis,2009,41(4):338-346. [3] Zhang X Q, Wang X L, Liu R, et al. Influence of temperature on nonlinear dynamic characteristics of spiral-grooved gas-lubricated thrust bearing-rotor systems for microengine[J]. Tribology International,2013,61:138-143. [4] Muro H. History and recent progress of MEMS physical sensors[C]∥Symposium E on Next Generation Micro/Nano Systems of CIMTEC/4th International Conference on Smart Materials, Structures and Systems, Montecatini Terme,2013:1-8. [5] 刘治华,李成,王春丽. 微观条件下的材料表面摩擦学性能测试[J]. 吉林大学学报:工学版,2007,37(1):95-99. Liu Zhi-hua,Li Cheng,Wang Chun-li. Test for micro-tribological performances of material surface[J]. Journal of Jilin University (Engineering and Technology Edition),2007,37(1):95-99. [6] 黎海文,贾宏光,吴一辉,等. 微摩擦测试仪力传感器的研究[J]. 光学精密工程,2002,10(4):388-391. Li Hai-wen, Jia Hong-guang, Wu Yi-hui,et al. Research on force sensors in a micro-friction test rig[J]. Optics and Precision Engineering,2002,10(4):388-391. [7] Beyaz M I, Hanrahan B M, Feldman J, et al. An integrated permanent-magnet microturbogenerator supported on microball bearings[J]. Journal of Microelectromechanical Systems,2013,22(3): 794-803. [8] Li J, Zhang Q X, Asundi A, et al. MEMS deep RIE fabrication process and device characterization[C]∥Microsystems Engineering: Metrology and Inspection III, Munich,2003:80-86. [9] Bargiel S, Gorecki C, Barański M, et al. 3-D micro-optical lens scanner made by multi-wafer bonding technology[C]∥The International Society for Optical Engineering, San Francisco,2014:861605. [10] Wang Z Y, Tian K, Zhou Y Z, et al. A high temperature silicon-on-insulator stress sensor[J]. Journal of Micromechanics and Microengineering,2008,18(4):1-11. [11] Schmidt M A. Wafer-to-wafer bonding for microstructure formation[J]. Proceedings of the IEEE,1998,86(6):1575-1585. [12] Wang Q, Yang X D, Zhang Y M, et al. A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging[J]. Microsystem Technologies,2011,17(10-11): 1629-1633. [13] Straessle R, Pellaton M, Affolderbach C, et al. Low-temperature indium-bonded alkali vapor cell for chip-scale atomic clocks[J]. Journal of Applied Physics, 2013,113(6):064501. [14] Keller S S, Bosco F G, Boisen A. Ferromagnetic shadow mask for spray coating of polymer patterns[J]. Microelectronic Engineering,2013,110:427-431. |
| [1] | KOU Shu-qing, SHI Zhou. Three-dimensional reconstruction of fracture-split connecting rod joint surface and its strength and stiffness [J]. Journal of Jilin University(Engineering and Technology Edition), 2018, 48(5): 1515-1523. |
| [2] | CHEN Chao, ZHAO Sheng-dun, CUI Min-chao, HAN Xiao-lan, FAN Shu-qin, ISHIDA Tohru. Experimental study on reshaping method for joining AL5052 aluminum alloy sheets [J]. 吉林大学学报(工学版), 2017, 47(5): 1512-1518. |
| [3] | ZHANG Peng, KOU Shu-qing, ZHAO Yong, LIN Bao-jun. Ananlsis of three rollers axial knurling process of assembled camshaft [J]. 吉林大学学报(工学版), 2016, 46(6): 1953-1960. |
|