吉林大学学报(工学版) ›› 2017, Vol. 47 ›› Issue (2): 510-517.doi: 10.13229/j.cnki.jdxbgxb201702023

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Characteristics of solder paste jetting valve driven by piezostack

GU Shou-dong1, LIU Jian-fang1, YANG Zhi-gang1, JIAO Xiao-yang2, JIANG Hai1, LU Song1   

  1. 1.College of Mechanical Science and Engineering,Jilin University,Changchun 130022,China;
    2.College of Biological and Agricultural Engineering,Jilin University,Changchun 130022,China
  • Received:2016-01-11 Online:2017-03-20 Published:2017-03-20

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Abstract: In order to pursue non-contact solder paste jetting to meet the high precision, fast speed and strong flexibility requirements in modern electronic packaging technology, a solder paste jetting valve driven by piezostack is designed. The system uses piezostack as the driving source, and adopts the striking injection technology to jet solder paste. First, solder paste jetting is theoretically analyzed and the influences of needle structure, nozzle diameter and needle striking speed on the solder paste jetting are investigated using Fluent software. Then, the jetting testing system is set up and the effects of the gap between nozzle and needle, the valve opening time and the driving pressure on the diameter of solder paste droplet are obtained.

Key words: turn and control of fluid, droplet ejection, piezoelectric driving, flow simulation, solder paste jetting

CLC Number: 

  • TH138
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