Abstract:

In order to explore the mechanism of workpiece material removal during abrasive flow machining, the molecular dynamics method was used to simulate the machining process that SiC particles micro-cut single crystal Fe. The microscopic mechanism of action that affects the cutting force variation and the reasons for the continuous fluctuation of cutting force in the process are studied. The internal reasons of physical change of workpiece material and the working law of abrasive grains on workpiece are revealed under the micro-cutting process. Through the analysis of atomic displacement, it can be seen that the plastic deformation of the material in the micro-cutting process is mainly caused by the slip region generated in the sliding surface of the crystal lattice to form dislocations, and the atoms move along dislocation lines. At the same time, the accumulation of atoms and the mechanism of chip formation are discussed. The polyhedron template matching method was used to analyze the arrangement of workpiece atoms in the micro-cutting process, and the variation of the lattice structure in the workpiece material was discussed. The research can provide theoretical basis and technical support for processing single crystal Fe with abrasive flow machining.

Key words: mechanical design, molecular dynamics, micro-cutting, single crystal Fe, atomic displacement, crystal structure, abrasive flow