游离磨料加工影响因素及材料去除模型研究进展

doi:10.13229/j.cnki.jdxbgxb.20240176

Abstract

Abstract:

This article reviews the parameters that influence free abrasive processing procedures and the models used to predict material removal. The text begins by introducing the common methods and principles of free abrasive processing. It then analyzes the impact of machining parameters on machining efficiency and surface quality. Finally， it summarizes the modeling method for material removal and provides prospects for future research directions.

Key words: machinery manufacturing technology and equipment, free abrasive machining, material removal model, influencing factor

CLC Number:

TG519.3

Chun-lei HE,Dong-yang LI,Cheng-zu REN. Research progress on influencing factors and material removal models for free abrasive machining[J].Journal of Jilin University(Engineering and Technology Edition), 2025, 55(4): 1123-1141.

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Summary of material removal model"

作者	材料去除模型	符号含义	建模特点
Wei等^［86］	$d V d t = K 0 3 C s 8 π R 3 r ζ + R 2 r ζ - r ζ d c d x ? k 1 ∫ ∫ p a d δ x H V v ζ$	C_s为体积分数；ζ为坐标；p_a为加工压力；H_V为硬度；R为粒径；v为流速；K_0、k₁为系数；dδ_x 为微分单元分量	将单磨料模型与活性磨料的统计模型相结合
薛进学等^［87］	$d H d t = ∫ - b b K p V v 1 F π L r i r 大 r 大 - r i 1 - μ 1 2 E 1 + 1 - μ 22 E 2 ? 1 - x b i 2 d x$	V为研具转速；v₁为工件转速；F为加工压力；r为工件半径；μ为泊松比；E为弹性模量；b_i 为接触线半宽	先整体分割，每个单元单独计算积分得到
Cheng等^［88］	$M R R = K m × K t × P × A × v × t$	K_m为介质常数；K_t 为时间常数；P为加工压力；A为接触面积；v为加工液流速；t时间	扩展系数K，从而考虑载液的流动特性
Zhao等^［89］	$M R R = K V f D a 2 / 3 - p m 2 / 3$	K（V）为相对速度；D_a为孔密度；p_m为工件接触顶点处压力；f为研具所受载荷	确定了软质研具下压力P的阈值及非线性关系
Runnels^［90］	$M R R = K P σ t + D σ t 2$	K（P）为材料、化学性质系数；D为孔密度；σ_t为剪切应力	建模结合了断裂力学与化学腐蚀
Luo等^［91］	$M R R = C 1 1 - φ 3 - C 2 P 0 1 / 3 P 0 V$	C₁为常数；φ为活性磨粒概率密度；P₀为接触应力；V为工件与研具相对速度	整合了硬度、研具粗糙度、磨料尺寸和形状
Sundararajan等^［92］	$M R R = M C u ρ C u × D K e q C F C N 0.893 Δ a v g × 1 + α τ W C A$	M_Cu为铜分子量；ρ_Cu为铜密度； K_eq为化学平衡常数；C_NC_F为化学剂浓度；D为扩散率；C_A为磨粒浓度	考虑了化学反应、载液流体力学及研磨颗粒形状
李敏等^［93］	$M R R = k 0 ? 3 n K U n + 1 R δ n + 1 c o s 2 n - 1 φ 2 n s i n φ + 2 n - 1 2 n ×$ $∫ c o s 2 n - 2 φ d φ - 1 2 n s i n φ c o s 2 n + 1 φ - 2 n + 1 2 n + 2 ∫ c o s 2 n φ d φ$	k₀ 为系数；n、K为体黏参数；U为速度；R为工件半径；δ为剪切层厚度；φ为常数；n为黏性指数	引入黏度特性，考虑非牛顿剪切增稠幂律流体的影响
张峰^［94］	$M R R = K P d + P m V$	K为普雷斯顿系数；P_d为流体动压力；P_m为磁流变液的磁化压力；V为速度	考虑了磁流变抛光的流体动压力和磁化压力
Li等^［23］	$M R R = K 0 ? 3 n K R ? U h 0 n + 1 ? f n, φ$	K₀、K为系数；n为黏度指数； U为加工液流速；φ为常数；h₀为间隙大小；R为工件半径	考虑了抛光液的黏性指数和稠度系数
张学成等^［95］	$M R R = K τ f U = K W f$	K为准Preston常数；τ为表面剪切应力；f为摩擦因数；U为磁射流冲击速度；W为冲击射流做功	基于CFD方法得到功率W与材料去除率的关系

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加工方法	磨料
化学机械抛光	化学溶液、磨粒
超声振动研磨	硬质磨粒
弹性发射加工	软质磨粒
磁流变抛光	磁流变液、磨粒
磁磨料抛光	磁性磨粒
磁性研磨	磁化磨料
磨料流加工	半固态黏弹性介质
摩擦化学抛光	硬质磨粒与化学作用
剪切增稠抛光	剪切增稠流体、磨粒

系列	名称	特性
氧化铝系	棕刚玉	硬度高，韧性大，便宜
	白刚玉	硬度更高，韧性较低
	单晶刚玉	球状颗粒，硬度韧性较高
	铬刚玉	韧性高，磨削粗糙度低
	微晶刚玉	磨粒为微小晶体，强度高
碳化物系	黑碳化硅	硬度高，脆且锋利
	绿碳化硅	硬度仅次于碳化硼和金刚石
	碳化硼	硬度高，耐磨性好
金刚石系	人造金刚石	硬度高，脆，表面粗糙
金刚石系	天然金刚石	硬度最高，价格贵
氧化物系	氧化铁	质软
氧化物系	二氧化硅	硬度适中，分散性好

加工方法	粒径范围/μm
磨料流加工	63~425
超声振动辅助研磨	0.5~5
磁流变抛光	3~10
磁性研磨	180
化学机械抛光	0.01~0.2
剪切增稠抛光	3~15

加工方法	质量分数/%
磨料流加工	30~50
超声振动辅助研磨	2.5~10
磁流变抛光	10~30
机械研磨	5~20
化学机械抛光	0~30

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Research progress on influencing factors and material removal models for free abrasive machining

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