吉林大学学报(工学版) ›› 2018, Vol. 48 ›› Issue (2): 500-506.doi: 10.13229/j.cnki.jdxbgxb20170238

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Analysis of intensity factors of interface crack in piezoelectric bimaterials

MENG Guang-wei, LI Rong-jia, WANG Xin, ZHOU Li-ming, GU Shuai   

  1. College of Mechanical Science and Engineering,Jilin University,Changchun 130022,China
  • Received:2017-08-16 Online:2018-03-01 Published:2018-03-01

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Abstract: In order to meet the requirement of commonality and effectiveness in solving the intensity factors of piezoelectric bimaterials with interface crack in practical engineering, based on piezoelectric interface facture mechanics, an explicit extrapolating formula of intensity factors for in-plane and anti-plane interface crack was derived. The interface crack-tip displacement field and electric filed of the piezoelectric bimaterials were simulated using the electromechanical coupling computation methods. Substituting the crack displacement and the electric potential jump at the back of the crack tip into the explicit extrapolating formula, the intensity factors of piezoelectric bimaterials with interface crack were solved. Considering a center interface crack in double piezoelectric plates, the intensity factors under different loadings, different numbers of elements, and different mesh refinement methods were discussed and compared with the analytical solution. Results of numerical examples show that the proposed method has the advantages of simple calculation and high accuracy.

Key words: information processing technology, electromechanical coupling, intensity factors, interfacial crack, piezoelectric biomaterials

CLC Number: 

  • TB115
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