硅微球轴承关键工艺

doi:10.13229/j.cnki.jdxbgxb201603022

吉林大学学报(工学版) ›› 2016, Vol. 46 ›› Issue (3): 824-830.doi: 10.13229/j.cnki.jdxbgxb201603022

硅微球轴承关键工艺

王犇, 王晓力

北京理工大学机械与车辆学院,北京 100081

收稿日期:2014-10-09 出版日期:2016-06-20 发布日期:2016-06-20
通讯作者: 王晓力(1965-),女,教授,博士生导师.研究方向:MEMS技术,摩擦磨损和润滑技术,测试技术.E-mail:xiaoli_wang@bit.edu.cn
作者简介:王犇(1985),女,博士研究生.研究方向:MEMS技术,摩擦磨损和润滑技术,测试技术.E-mail:wangben1985@126.com
基金资助:
国家自然科学基金项目(51275046).

Key processes of silicon microball bearing

WANG Ben, WANG Xiao-li

School of Mechanical Engineering, Beijing Institute of Technology, Beijing 100081, China

Received:2014-10-09 Online:2016-06-20 Published:2016-06-20

摘要/Abstract

摘要： 首先,对微球轴承的滚道结构、滚动体数目和轴承腔通气孔进行了设计。其次,采用环形刻蚀(Halo etch)技术实现了叶片层上多特征尺寸结构的加工,提高了刻蚀速率的一致性和图形精度,为降低转子不平衡量、提高微球轴承的高速运转稳定性提供保障。此外,利用中间层键合(Intermediate-layer bonds)技术和遮罩(Shadow mask)技术制造出封闭的轴承腔,避免了由于温度过高而产生的微球热变形,同时避免了由于中间层材料沉积在滚道中而引起的轴承腔堵塞和微球粘黏滚道。本研究为微机电系统(MEMS)微球轴承设计和制造提供了新的技术途径。

关键词: 机械制造工艺与设备, 微机电系统, 微球轴承, 环形刻蚀, 遮罩

Abstract: The key processes of silicon microball bearing were investigated. First, the structure of raceway, the number of rolling elements and the nozzle of the bearing chamber of the microball bearing were designed. Then, the Halo Etch technology was employed to fabricate the blade with various characteristic dimensions and to improve the uniformity of etch rate and the pattern precision, thus, reducing the imbalance of rotor and increasing the stability of the microball bearing at high speed. Moreover, the intermediate-layer bonds and shadow mask technologies were used to encapsulate the bearing chamber and reduce the thermal deformation caused by the extremely high temperature and to avoid the clogging of the bearing chamber and the ball raceway adhesion caused by the deposited intermediate materials. A strategy for the design and fabrication of microball bearings in Micro-electromechanical System (MEMS) is provided.

Key words: manufacturing process and equipment, micro-electromechanical system (MEMS), microball bearing, halo etch, shadow mask

中图分类号:

TH162

王犇, 王晓力. 硅微球轴承关键工艺[J]. 吉林大学学报(工学版), 2016, 46(3): 824-830.

WANG Ben, WANG Xiao-li. Key processes of silicon microball bearing[J]. 吉林大学学报(工学版), 2016, 46(3): 824-830.

参考文献

[1] Beyaz M I, Hanrahan B M, Feldman J, et al. Monitoring of actuation conditions in a micro-turbo-generator[J]. IEEE Sensors Journal,2013,13(8):2937-2943.
[2] Xie G X, Ding J N, Liu S H, et al. Interfacial properties for real rough MEMS/NEMS surfaces by incorporating the electrostatic and Casimir effects-a theoretical study[J]. Surface and Interface Analysis,2009,41(4):338-346.
[3] Zhang X Q, Wang X L, Liu R, et al. Influence of temperature on nonlinear dynamic characteristics of spiral-grooved gas-lubricated thrust bearing-rotor systems for microengine[J]. Tribology International,2013,61:138-143.
[4] Muro H. History and recent progress of MEMS physical sensors[C]∥Symposium E on Next Generation Micro/Nano Systems of CIMTEC/4th International Conference on Smart Materials, Structures and Systems, Montecatini Terme,2013:1-8.
[5] 刘治华,李成,王春丽. 微观条件下的材料表面摩擦学性能测试[J]. 吉林大学学报:工学版,2007,37(1):95-99.
Liu Zhi-hua,Li Cheng,Wang Chun-li. Test for micro-tribological performances of material surface[J]. Journal of Jilin University (Engineering and Technology Edition),2007,37(1):95-99.
[6] 黎海文,贾宏光,吴一辉,等. 微摩擦测试仪力传感器的研究[J]. 光学精密工程,2002,10(4):388-391.
Li Hai-wen, Jia Hong-guang, Wu Yi-hui,et al. Research on force sensors in a micro-friction test rig[J]. Optics and Precision Engineering,2002,10(4):388-391.
[7] Beyaz M I, Hanrahan B M, Feldman J, et al. An integrated permanent-magnet microturbogenerator supported on microball bearings[J]. Journal of Microelectromechanical Systems,2013,22(3): 794-803.
[8] Li J, Zhang Q X, Asundi A, et al. MEMS deep RIE fabrication process and device characterization[C]∥Microsystems Engineering: Metrology and Inspection III, Munich,2003:80-86.
[9] Bargiel S, Gorecki C, Barański M, et al. 3-D micro-optical lens scanner made by multi-wafer bonding technology[C]∥The International Society for Optical Engineering, San Francisco,2014:861605.
[10] Wang Z Y, Tian K, Zhou Y Z, et al. A high temperature silicon-on-insulator stress sensor[J]. Journal of Micromechanics and Microengineering,2008,18(4):1-11.
[11] Schmidt M A. Wafer-to-wafer bonding for microstructure formation[J]. Proceedings of the IEEE,1998,86(6):1575-1585.
[12] Wang Q, Yang X D, Zhang Y M, et al. A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging[J]. Microsystem Technologies,2011,17(10-11): 1629-1633.
[13] Straessle R, Pellaton M, Affolderbach C, et al. Low-temperature indium-bonded alkali vapor cell for chip-scale atomic clocks[J]. Journal of Applied Physics, 2013,113(6):064501.
[14] Keller S S, Bosco F G, Boisen A. Ferromagnetic shadow mask for spray coating of polymer patterns[J]. Microelectronic Engineering,2013,110:427-431.

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硅微球轴承关键工艺

Key processes of silicon microball bearing

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