强流脉冲电子束诱发的Cu-C扩散合金化

doi:10.13229/j.cnki.jdxbgxb201606028

摘要/Abstract

摘要： 采用真空烧结技术制备了w(C)=6%的Cu-C(其中C为片状石墨)块状复合材料,利用强流脉冲电子束(HCPEB)技术对样品进行表面辐照处理,辐照次数分别为1、5、20和40。利用X-ray衍射仪(XRD)、扫描电子显微镜(SEM)以及透射电子显微镜(TEM)详细分析了辐照样品的相组成和微观结构,并考查了经HCPEB辐照处理后样品表面的摩擦磨损性能。XRD结果表明:经HCPEB辐照后,衍射峰向高角度偏移,Cu-C间发生固溶,部分C原子与Cu原子形成间隙固溶体,理论计算结果显示最大固溶度达到2.24%。微结构分析结果表明:辐照表面形成高密度的Cu、C纳米晶粒,并在基体Cu中诱发了高密度晶体缺陷,这些结构为C原子的扩散提供了大量的扩散通道。此外,经HCPEB技术处理后材料表面的摩擦磨损性能得到了明显改善。

关键词: 金属材料, 强流脉冲电子束, Cu-C复合材料, 固溶体, 扩散, 摩擦磨损性能

Abstract: High Current Pulsed Electron Beam (HCPEB) was employed for the surface irradiation of Cu-C composite material made by high sintering, where C is in the form of flake graphite. The irradiating times were 1, 5, 20 and 40 respectively. The phase composition and microstructure of the irradiated samples were analyzed in detail using XRD, SEM and TEM. The surface friction and wear properties of the irradiated samples were also examined. Results of XRD indicate that the diffraction peak shifts to high angle after HCPEB irradiation, and the solid solution occurs between Cu-C. Furthermore, C atoms and Cu atoms forms interstitial solid solution partly, and the maximum calculated solid solubility reaches 2.24%. Microscopic results show that high density Cu and C nanoparticles are formed on the irradiated surface, and high density crystal defect is induced in the matrix Cu at the same time, which provides a large number of diffusion channels for the diffusion of C atoms. Furthermore, the friction and wear properties of the material are improved obviously after HCPEB irradiation.

Key words: metallic material, high current pulsed electron beam(HCPEB), Cu-C composite material, solid solution, diffusion, friction and wear properties

中图分类号:

TG156

关庆丰, 黄尉, 李怀福, 龚晓花, 张从林, 吕鹏. 强流脉冲电子束诱发的Cu-C扩散合金化[J]. 吉林大学学报(工学版), 2016, 46(6): 1967-1973.

GUAN Qing-feng, HUANG Wei, LI Huai-fu, GONG Xiao-hua, ZHANG Cong-lin, LYU Peng. Diffusion alloying of Cu-C induced by high current pulsed electron beam[J]. 吉林大学学报(工学版), 2016, 46(6): 1967-1973.

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